CHInano 2016 Conference & Expo

2016 International Conference on Commercialization of Transducer & MEMS
Date: 26th Afternoon-27th October, 2016
Venue: G103-G104, G Hall, Suzhou International Expo Center

Conference Introduction

Key Topics

Schedule&Speakers

Contact/Fees&Login

Schedule&Speakers

Date: Oct.26, 2016	Meeting Room: G103-104
Time	Speaker	Speaker’s Position/Organization and Speech Title
Session 1 Session Chair：Xinxin Li
13:30-13:35	Xinxin Li	Conference Chair Opening Address
13:35-14:00	Doug Sparks	Executive Vice President, Hanking Electronics Co., Ltd. MEMS/Nanotechnology Business Growth in China by Partnerships, JVs and Acquisitions
14:00-14:25	Steffen Diez	Member of Technical Board, Application Lab Manager, Stella International Co., Ltd. The Next Generation of Maskless Lithography
14:25-14:50	Yunlong Gao	General Manager of Beijing Advancedmems Co., Ltd. Application of Ion Beam Technology in Non-silicon MEMS
14:50-15:15	Yang Zhao	Chairman & CEO, Conference Co-Chairman Memsic Inc. Future Role of Sensors in Man-Machine System
15:15-15:30	Tea Break
Session 2 Session Chair：Yang Zhao
15:30-15:55	Xinxin Li	Professor, Chairman, State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences ‘MIS’ MEMS Batch Fabrication Makes Sensors Tiny, Cheap but Good.
15:55 -16:20	Max Cai	Specialist of SUSS MicroTec (Shanghai) Co., Ltd. Wafer Level Metal Bonding on SUSS Universal Bonder - XB8
16:20 -16:45	Zongyi Li	Director of Design & Development Dept. of Jiangsu Changjiang Electronics Technology Co., Ltd. SiP Packaging Technology of Intelligent Sensor Module
16:45 -17:10	Mingbo Wang	Director for Sales and Marketing, KINGSEMI Co., Ltd. KINGSEMI’s Equipment and Technology for Advanced MEMS
17:10 -17:35	Jin Qiu	Vice President of MEMS Technology of QST Co., Ltd. MEMS Development in QST
18:30-20:30	Reception Dinner (Invitation Only)
Date: Oct.27, 2016	Meeting room: G103-104
Time	Speaker	Speaker’s Position/Organization and Speech Title
Session3 Session Chair：Yunlong Gao
08:55-09:20	Quor Hahn Leong	Director, Product Strategy & Technical Marketing of Applied Materials, Inc . ≤200mm Equipment Technology Development in the More-than-Moore Era
09:20-09:45	Zewen Liu	Ph.D., Professor, Institute of Microelectronics, Tsinghua University RF MEMS: Not Only High Q
09:45-10:10	Xavier Baraton	Strategic Business Development Director, Asia-Pacific, STMicroelectronics STMicroelectronics’ Solutions Speeding Up Revolution of Robotics and IoT
10:10-10:30	Tea Break
Session 4 Session Chair：Doug Sparks
10:30-10:55	Zhi Wang	Director of Product Marketing for Sensors, GoerTek Inc. The Trend of MEMS Sensors Applied in Consumer Electronics
10:55-11:20	Phil Lai	Application Assistant Manager, Spirox Corporation MEMS Sensor Testing Requirement and Challenge
11:20-11:45	Yie He	Chairman of the Board IntelliSense, Corp. Advancement of MEMS Design Tool and Application
11:45-12:10	Peter Sijbers	Deputy General Manager, Technical Director, Sensirion China Co., Ltd. Sensirion Sensor Solutions
12:10-13:15	Lunch
Session 5 Session Chair：Jianmin Miao
13:30-13:55	Daquan Yu	CTO, HuaTian Group MEMS Packaging: Miniaturization and System Integration Trend
13:55-14:20	Johnson Sun	Senior Applications Engineering Manager, Sensors BL, Automotive Group NXP Semiconductors Monetizing Sensor Data with Smart Sensing and Data Analytics
14:20-14:45	Roc Blumenthal	Senior Director, Application Marketing, Semiconductor Manufacturing International Corporation (SMIC) MEMS Sensors in the Age of IOT
14:45-15:10	Eric Pabo	Business Development Manager MEMS, EVGroup Recent Advances in Aligned Wafer Bonding for MEMS and 3DICs
15:10-15:30	Tea Break
Session 5 Session Chair：Steffen Diez
15:30-15:55	Gary Li	Ph.D, CEO, Suzhou MEMSensing Microsystems Co., Ltd. MEMSensing - A Pioneer in Domestic MEMS Industry Integration
15:55-16:20	Schiu Sche	Board of Directors, Micro Sensing Technology Inc. The Modular Integrated Construction Industry An Application Platform for Micro Opto Electro Mechanical Systems MOEMS
16:20 -16:45	Jianmin Miao	Professor, Nanyang Technological University Singapore Conference Co-Chairman Three-dimensional Graphene for High Performance Air Pollution Sensing
16:45 -17:10	Weiqiang Qiu	Manager of South China, Jiuhao Micro-electronics Co., Ltd. Signal Conditioning ICs for MEMS Pressure Sensing Element
17:10 -17:35	Suan Sun	General Management, SPEA Considerations for Lowering the Cost of MEMS Testing

Remark: The exact conference schedule will be provided on the day of conference. The Organizing Committee reserves the right of final interpretation.

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